Consumer electronics camera module underfill: conductive silver adhesive case study

Background

An equipment integrator / manufacturer in Consumer electronics needed to underfill on a camera module using conductive silver adhesive.

Process challenge

Supply pressure ripple during continuous running, causing volume drift.

Solution

We recommended Screw Valve + Dispensing Valve, with adding regulated supply with a drum pump for continuous feed to suppress pressure ripple.

Result

• Potting void defects reduced from 4% to below 1%.
• Shot volume 1.5 mL with deviation within ±3%.
• Cycle time 0.3 s per dot with no stringing or dripping during continuous running.

Project facts

• Industry: Consumer electronics
• Workpiece: camera module
• Fluid: conductive silver adhesive
• Process: underfill
• Recommended lines: Screw Valve, Dispensing Valve

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