Background
An equipment integrator / manufacturer in Consumer electronics needed to sealing and bonding on a TWS earbud housing using UV-curing structural adhesive.
Process challenge
Tight cycle time with frequent changeovers that squeeze setup time.
Solution
We recommended Screw Valve + Dispensing Valve, with fitting quick-change interfaces and parameter recipes to shorten setup time.
Result
- Potting void defects reduced from 4% to below 1%.
- Shot volume 0.4 mL with deviation within ±3%.
- Cycle time 0.9 s per dot with no stringing or dripping during continuous running.
Project facts
- Industry: Consumer electronics
- Workpiece: TWS earbud housing
- Fluid: UV-curing structural adhesive
- Process: sealing and bonding
- Recommended lines: Screw Valve, Dispensing Valve
Note: this case is placeholder demo content showing the structure of the section. Replace it with real project data before publishing.
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