Automotive electronics ECU unit underfill: UV-curing structural adhesive case study

Background

An equipment integrator / manufacturer in Automotive electronics needed to underfill on a ECU unit using UV-curing structural adhesive.

Process challenge

Particle fillers settling and clogging after long idle periods.

Solution

We recommended Pneumatic Valve + Glue Supply System, with tuning rotor/stator fit and flow path geometry to the filler particle size.

Result

• Potting void defects reduced from 4% to below 1%.
• Shot volume 0.02 mL with deviation within ±3%.
• Cycle time 0.6 s per dot with no stringing or dripping during continuous running.

Project facts

• Industry: Automotive electronics
• Workpiece: ECU unit
• Fluid: UV-curing structural adhesive
• Process: underfill
• Recommended lines: Pneumatic Valve, Glue Supply System

Note: this case is placeholder demo content showing the structure of the section. Replace it with real project data before publishing.