Optoelectronics and display light guide assembly underfill: instant adhesive case study

Background

An equipment integrator / manufacturer in Optoelectronics and display needed to underfill on a light guide assembly using instant adhesive.

Process challenge

Large potting volume where voiding and incomplete fill are hard to balance.

Solution

We recommended Dispensing Valve + Glue Distributing Machine, with tuning rotor/stator fit and flow path geometry to the filler particle size.

Result

• Overflow and stringing defects reduced by roughly 60%.
• Shot volume 0.4 mL with deviation within ±2%.
• Cycle time 0.8 s per dot with no stringing or dripping during continuous running.

Project facts

• Industry: Optoelectronics and display
• Workpiece: light guide assembly
• Fluid: instant adhesive
• Process: underfill
• Recommended lines: Dispensing Valve, Glue Distributing Machine

Note: this case is placeholder demo content showing the structure of the section. Replace it with real project data before publishing.