Background
An equipment integrator / manufacturer in Optoelectronics and display needed to underfill on a light guide assembly using conductive silver adhesive.
Process challenge
Large potting volume where voiding and incomplete fill are hard to balance.
Solution
We recommended Dispensing Valve + Glue Distributing Machine, with using a servo dispensing module with a programmable speed profile to hold a constant extrusion rate.
Result
- Overflow and stringing defects reduced by roughly 60%.
- Shot volume 4 mL with deviation within ±2%.
- Cycle time 0.8 s per dot with no stringing or dripping during continuous running.
Project facts
- Industry: Optoelectronics and display
- Workpiece: light guide assembly
- Fluid: conductive silver adhesive
- Process: underfill
- Recommended lines: Dispensing Valve, Glue Distributing Machine
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