Optoelectronics and display light guide assembly underfill: conductive silver adhesive case study

Background

An equipment integrator / manufacturer in Optoelectronics and display needed to underfill on a light guide assembly using conductive silver adhesive.

Process challenge

Large potting volume where voiding and incomplete fill are hard to balance.

Solution

We recommended Dispensing Valve + Glue Distributing Machine, with using a servo dispensing module with a programmable speed profile to hold a constant extrusion rate.

Result

Overflow and stringing defects reduced by roughly 60%.
Shot volume 4 mL with deviation within ±2%.
Cycle time 0.8 s per dot with no stringing or dripping during continuous running.

Project facts

Industry: Optoelectronics and display
Workpiece: light guide assembly
Fluid: conductive silver adhesive
Process: underfill
Recommended lines: Dispensing Valve, Glue Distributing Machine

Note: this case is placeholder demo content showing the structure of the section. Replace it with real project data before publishing.