Background
An equipment integrator / manufacturer in Semiconductor and packaging needed to dispensing on a BGA package substrate using UV-curing structural adhesive.
Process challenge
Very small shot volume with high repeatability demands, plus overflow and stringing risk.
Solution
We recommended Servo Dispensing Module + Screw Valve, with replacing time-pressure control with a positive-displacement screw valve to meter by volume.
Result
- Volume repeatability improved from ±5% to within ±2%.
- Shot volume 0.02 mL with deviation within ±2%.
- Cycle time 0.4 s per dot with no stringing or dripping during continuous running.
Project facts
- Industry: Semiconductor and packaging
- Workpiece: BGA package substrate
- Fluid: UV-curing structural adhesive
- Process: dispensing
- Recommended lines: Servo Dispensing Module, Screw Valve
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