Semiconductor and packaging power device potting: two-component epoxy case study

Background

An equipment integrator / manufacturer in Semiconductor and packaging needed to potting on a power device using two-component epoxy.

Process challenge

Supply pressure ripple during continuous running, causing volume drift.

Solution

We recommended Servo Dispensing Module + Screw Valve, with using a servo dispensing module with a programmable speed profile to hold a constant extrusion rate.

Result

Volume repeatability improved from ±5% to within ±2%.
Shot volume 0.008 mL with deviation within ±2%.
Cycle time 1.0 s per dot with no stringing or dripping during continuous running.

Project facts

Industry: Semiconductor and packaging
Workpiece: power device
Fluid: two-component epoxy
Process: potting
Recommended lines: Servo Dispensing Module, Screw Valve

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