Semiconductor and packaging CSP chip coating: two-component epoxy case study

Background

An equipment integrator / manufacturer in Semiconductor and packaging needed to coating on a CSP chip using two-component epoxy.

Process challenge

Tight cycle time with frequent changeovers that squeeze setup time.

Solution

We recommended Servo Dispensing Module + Screw Valve, with adding regulated supply with a drum pump for continuous feed to suppress pressure ripple.

Result

• Volume drift held within ±3% over an 8-hour run.
• Shot volume 4 mL with deviation within ±2%.
• Cycle time 0.7 s per dot with no stringing or dripping during continuous running.

Project facts

• Industry: Semiconductor and packaging
• Workpiece: CSP chip
• Fluid: two-component epoxy
• Process: coating
• Recommended lines: Servo Dispensing Module, Screw Valve

Note: this case is placeholder demo content showing the structure of the section. Replace it with real project data before publishing.