Background
An equipment integrator / manufacturer in Semiconductor and packaging needed to sealing and bonding on a BGA package substrate using filled thermal gel.
Process challenge
Very small shot volume with high repeatability demands, plus overflow and stringing risk.
Solution
We recommended Servo Dispensing Module + Screw Valve, with using a precision dispensing valve with suck-back and servo three-axis motion for uniform coating.
Result
- Overflow and stringing defects reduced by roughly 60%.
- Shot volume 0.4 mL with deviation within ±2%.
- Cycle time 1.0 s per dot with no stringing or dripping during continuous running.
Project facts
- Industry: Semiconductor and packaging
- Workpiece: BGA package substrate
- Fluid: filled thermal gel
- Process: sealing and bonding
- Recommended lines: Servo Dispensing Module, Screw Valve
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