Semiconductor and packaging sensor die potting: silicone sealant case study

Background

An equipment integrator / manufacturer in Semiconductor and packaging needed to potting on a sensor die using silicone sealant.

Process challenge

Micro-litre volumes with expensive material and no waste allowed.

Solution

We recommended Servo Dispensing Module + Screw Valve, with replacing time-pressure control with a positive-displacement screw valve to meter by volume.

Result

Filler-related stoppages reduced from three per week to one per month.
Shot volume 0.02 mL with deviation within ±2%.
Cycle time 1.0 s per dot with no stringing or dripping during continuous running.

Project facts

Industry: Semiconductor and packaging
Workpiece: sensor die
Fluid: silicone sealant
Process: potting
Recommended lines: Servo Dispensing Module, Screw Valve

Note: this case is placeholder demo content showing the structure of the section. Replace it with real project data before publishing.