Semiconductor and packaging BGA package substrate coating: conductive silver adhesive case study

Background

An equipment integrator / manufacturer in Semiconductor and packaging needed to coating on a BGA package substrate using conductive silver adhesive.

Process challenge

Very small shot volume with high repeatability demands, plus overflow and stringing risk.

Solution

We recommended Servo Dispensing Module + Screw Valve, with using a servo dispensing module with a programmable speed profile to hold a constant extrusion rate.

Result

Material utilisation improved by about 8% with visibly less waste.
Shot volume 0.008 mL with deviation within ±2%.
Cycle time 0.7 s per dot with no stringing or dripping during continuous running.

Project facts

Industry: Semiconductor and packaging
Workpiece: BGA package substrate
Fluid: conductive silver adhesive
Process: coating
Recommended lines: Servo Dispensing Module, Screw Valve

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