Semiconductor and packaging power device underfill: conductive silver adhesive case study

Background

An equipment integrator / manufacturer in Semiconductor and packaging needed to underfill on a power device using conductive silver adhesive.

Process challenge

Supply pressure ripple during continuous running, causing volume drift.

Solution

We recommended Servo Dispensing Module + Screw Valve, with tuning rotor/stator fit and flow path geometry to the filler particle size.

Result

• Potting void defects reduced from 4% to below 1%.
• Shot volume 4 mL with deviation within ±2%.
• Cycle time 0.4 s per dot with no stringing or dripping during continuous running.

Project facts

• Industry: Semiconductor and packaging
• Workpiece: power device
• Fluid: conductive silver adhesive
• Process: underfill
• Recommended lines: Servo Dispensing Module, Screw Valve

Note: this case is placeholder demo content showing the structure of the section. Replace it with real project data before publishing.