Background
An equipment integrator / manufacturer in Semiconductor and packaging needed to sealing and bonding on a CSP chip using UV-curing structural adhesive.
Process challenge
Tight cycle time with frequent changeovers that squeeze setup time.
Solution
We recommended Servo Dispensing Module + Screw Valve, with fitting quick-change interfaces and parameter recipes to shorten setup time.
Result
- Potting void defects reduced from 4% to below 1%.
- Shot volume 1.5 mL with deviation within ±2%.
- Cycle time 1.0 s per dot with no stringing or dripping during continuous running.
Project facts
- Industry: Semiconductor and packaging
- Workpiece: CSP chip
- Fluid: UV-curing structural adhesive
- Process: sealing and bonding
- Recommended lines: Servo Dispensing Module, Screw Valve
Note: this case is placeholder demo content showing the structure of the section. Replace it with real project data before publishing.
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