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Precision Fluid Control Components · R&D / Manufacturing / OEM Support

Semiconductor and packaging sensor die metered filling: two-component epoxy case study

2026.01.08

Background

An equipment integrator / manufacturer in Semiconductor and packaging needed to metered filling on a sensor die using two-component epoxy.

Process challenge

Micro-litre volumes with expensive material and no waste allowed.

Solution

We recommended Servo Dispensing Module + Screw Valve, with using a precision dispensing valve with suck-back and servo three-axis motion for uniform coating.

Result

  • Overall equipment availability improved by about 12%.
  • Shot volume 0.4 mL with deviation within ±2%.
  • Cycle time 0.7 s per dot with no stringing or dripping during continuous running.

Project facts

  • Industry: Semiconductor and packaging
  • Workpiece: sensor die
  • Fluid: two-component epoxy
  • Process: metered filling
  • Recommended lines: Servo Dispensing Module, Screw Valve
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