Semiconductor and packaging CSP chip coating: polyurethane potting compound case study

Background

An equipment integrator / manufacturer in Semiconductor and packaging needed to coating on a CSP chip using polyurethane potting compound.

Process challenge

Tight cycle time with frequent changeovers that squeeze setup time.

Solution

We recommended Servo Dispensing Module + Screw Valve, with using a servo dispensing module with a programmable speed profile to hold a constant extrusion rate.

Result

Volume drift held within ±3% over an 8-hour run.
Shot volume 0.02 mL with deviation within ±2%.
Cycle time 0.7 s per dot with no stringing or dripping during continuous running.

Project facts

Industry: Semiconductor and packaging
Workpiece: CSP chip
Fluid: polyurethane potting compound
Process: coating
Recommended lines: Servo Dispensing Module, Screw Valve

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