Semiconductor and packaging sensor die underfill: instant adhesive case study

Background

An equipment integrator / manufacturer in Semiconductor and packaging needed to underfill on a sensor die using instant adhesive.

Process challenge

Micro-litre volumes with expensive material and no waste allowed.

Solution

We recommended Servo Dispensing Module + Screw Valve, with adding regulated supply with a drum pump for continuous feed to suppress pressure ripple.

Result

• Overflow and stringing defects reduced by roughly 60%.
• Shot volume 0.008 mL with deviation within ±2%.
• Cycle time 0.4 s per dot with no stringing or dripping during continuous running.

Project facts

• Industry: Semiconductor and packaging
• Workpiece: sensor die
• Fluid: instant adhesive
• Process: underfill
• Recommended lines: Servo Dispensing Module, Screw Valve

Note: this case is placeholder demo content showing the structure of the section. Replace it with real project data before publishing.