Semiconductor and packaging BGA package substrate sealing and bonding: instant adhesive case study

Background

An equipment integrator / manufacturer in Semiconductor and packaging needed to sealing and bonding on a BGA package substrate using instant adhesive.

Process challenge

Very small shot volume with high repeatability demands, plus overflow and stringing risk.

Solution

We recommended Servo Dispensing Module + Screw Valve, with tuning rotor/stator fit and flow path geometry to the filler particle size.

Result

Overflow and stringing defects reduced by roughly 60%.
Shot volume 4 mL with deviation within ±2%.
Cycle time 1.0 s per dot with no stringing or dripping during continuous running.

Project facts

Industry: Semiconductor and packaging
Workpiece: BGA package substrate
Fluid: instant adhesive
Process: sealing and bonding
Recommended lines: Servo Dispensing Module, Screw Valve

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