Semiconductor and packaging CSP chip dispensing: conductive silver adhesive case study

Background

An equipment integrator / manufacturer in Semiconductor and packaging needed to dispensing on a CSP chip using conductive silver adhesive.

Process challenge

Tight cycle time with frequent changeovers that squeeze setup time.

Solution

We recommended Servo Dispensing Module + Screw Valve, with using a precision dispensing valve with suck-back and servo three-axis motion for uniform coating.

Result

Filler-related stoppages reduced from three per week to one per month.
Shot volume 0.4 mL with deviation within ±2%.
Cycle time 0.4 s per dot with no stringing or dripping during continuous running.

Project facts

Industry: Semiconductor and packaging
Workpiece: CSP chip
Fluid: conductive silver adhesive
Process: dispensing
Recommended lines: Servo Dispensing Module, Screw Valve

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