Semiconductor and packaging sensor die potting: UV-curing structural adhesive case study

Background

An equipment integrator / manufacturer in Semiconductor and packaging needed to potting on a sensor die using UV-curing structural adhesive.

Process challenge

Micro-litre volumes with expensive material and no waste allowed.

Solution

We recommended Servo Dispensing Module + Screw Valve, with using a high-flow pneumatic valve for staged potting together with vacuum de-airing.

Result

• Filler-related stoppages reduced from three per week to one per month.
• Shot volume 0.1 mL with deviation within ±2%.
• Cycle time 1.0 s per dot with no stringing or dripping during continuous running.

Project facts

• Industry: Semiconductor and packaging
• Workpiece: sensor die
• Fluid: UV-curing structural adhesive
• Process: potting
• Recommended lines: Servo Dispensing Module, Screw Valve

Note: this case is placeholder demo content showing the structure of the section. Replace it with real project data before publishing.