Semiconductor and packaging power device underfill: thermal grease case study

Background

An equipment integrator / manufacturer in Semiconductor and packaging needed to underfill on a power device using thermal grease.

Process challenge

Supply pressure ripple during continuous running, causing volume drift.

Solution

We recommended Servo Dispensing Module + Screw Valve, with using a servo dispensing module with a programmable speed profile to hold a constant extrusion rate.

Result

Potting void defects reduced from 4% to below 1%.
Shot volume 0.02 mL with deviation within ±2%.
Cycle time 0.4 s per dot with no stringing or dripping during continuous running.

Project facts

Industry: Semiconductor and packaging
Workpiece: power device
Fluid: thermal grease
Process: underfill
Recommended lines: Servo Dispensing Module, Screw Valve

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