Semiconductor and packaging CSP chip sealing and bonding: filled thermal gel case study

Background

An equipment integrator / manufacturer in Semiconductor and packaging needed to sealing and bonding on a CSP chip using filled thermal gel.

Process challenge

Tight cycle time with frequent changeovers that squeeze setup time.

Solution

We recommended Servo Dispensing Module + Screw Valve, with adding regulated supply with a drum pump for continuous feed to suppress pressure ripple.

Result

• Potting void defects reduced from 4% to below 1%.
• Shot volume 0.008 mL with deviation within ±2%.
• Cycle time 1.0 s per dot with no stringing or dripping during continuous running.

Project facts

• Industry: Semiconductor and packaging
• Workpiece: CSP chip
• Fluid: filled thermal gel
• Process: sealing and bonding
• Recommended lines: Servo Dispensing Module, Screw Valve

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