Semiconductor and packaging sensor die metered filling: filled thermal gel case study

Background

An equipment integrator / manufacturer in Semiconductor and packaging needed to metered filling on a sensor die using filled thermal gel.

Process challenge

Micro-litre volumes with expensive material and no waste allowed.

Solution

We recommended Servo Dispensing Module + Screw Valve, with tuning rotor/stator fit and flow path geometry to the filler particle size.

Result

• Overall equipment availability improved by about 12%.
• Shot volume 4 mL with deviation within ±2%.
• Cycle time 0.7 s per dot with no stringing or dripping during continuous running.

Project facts

• Industry: Semiconductor and packaging
• Workpiece: sensor die
• Fluid: filled thermal gel
• Process: metered filling
• Recommended lines: Servo Dispensing Module, Screw Valve

Note: this case is placeholder demo content showing the structure of the section. Replace it with real project data before publishing.