Semiconductor and packaging BGA package substrate dispensing: polyurethane potting compound case study

Background

An equipment integrator / manufacturer in Semiconductor and packaging needed to dispensing on a BGA package substrate using polyurethane potting compound.

Process challenge

Very small shot volume with high repeatability demands, plus overflow and stringing risk.

Solution

We recommended Servo Dispensing Module + Screw Valve, with using a precision dispensing valve with suck-back and servo three-axis motion for uniform coating.

Result

Volume repeatability improved from ±5% to within ±2%.
Shot volume 1.5 mL with deviation within ±2%.
Cycle time 0.4 s per dot with no stringing or dripping during continuous running.

Project facts

Industry: Semiconductor and packaging
Workpiece: BGA package substrate
Fluid: polyurethane potting compound
Process: dispensing
Recommended lines: Servo Dispensing Module, Screw Valve