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Precision Fluid Control Components · R&D / Manufacturing / OEM Support

2026.06.03

Semiconductor and packaging BGA package substrate dispensing: polyurethane potting compound case study

Background

An equipment integrator / manufacturer in Semiconductor and packaging needed to dispensing on a BGA package substrate using polyurethane potting compound.

Process challenge

Very small shot volume with high repeatability demands, plus overflow and stringing risk.

Solution

We recommended Servo Dispensing Module + Screw Valve, with using a precision dispensing valve with suck-back and servo three-axis motion for uniform coating.

Result

  • Volume repeatability improved from ±5% to within ±2%.
  • Shot volume 1.5 mL with deviation within ±2%.
  • Cycle time 0.4 s per dot with no stringing or dripping during continuous running.

Project facts

  • Industry: Semiconductor and packaging
  • Workpiece: BGA package substrate
  • Fluid: polyurethane potting compound
  • Process: dispensing
  • Recommended lines: Servo Dispensing Module, Screw Valve

Note: this case is placeholder demo content showing the structure of the section. Replace it with real project data before publishing.

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