Semiconductor and packaging power device potting: instant adhesive case study

Background

An equipment integrator / manufacturer in Semiconductor and packaging needed to potting on a power device using instant adhesive.

Process challenge

Supply pressure ripple during continuous running, causing volume drift.

Solution

We recommended Servo Dispensing Module + Screw Valve, with pairing a micro screw valve with a level sensor in closed loop for accurate volumetric output.

Result

Volume repeatability improved from ±5% to within ±2%.
Shot volume 0.4 mL with deviation within ±2%.
Cycle time 1.0 s per dot with no stringing or dripping during continuous running.

Project facts

Industry: Semiconductor and packaging
Workpiece: power device
Fluid: instant adhesive
Process: potting
Recommended lines: Servo Dispensing Module, Screw Valve

Note: this case is placeholder demo content showing the structure of the section. Replace it with real project data before publishing.