Background
An equipment integrator / manufacturer in Semiconductor and packaging needed to sealing and bonding on a BGA package substrate using UV-curing structural adhesive.
Process challenge
Very small shot volume with high repeatability demands, plus overflow and stringing risk.
Solution
We recommended Servo Dispensing Module + Screw Valve, with using a servo dispensing module with a programmable speed profile to hold a constant extrusion rate.
Result
- Overflow and stringing defects reduced by roughly 60%.
- Shot volume 0.02 mL with deviation within ±2%.
- Cycle time 1.0 s per dot with no stringing or dripping during continuous running.
Project facts
- Industry: Semiconductor and packaging
- Workpiece: BGA package substrate
- Fluid: UV-curing structural adhesive
- Process: sealing and bonding
- Recommended lines: Servo Dispensing Module, Screw Valve
Note: this case is placeholder demo content showing the structure of the section. Replace it with real project data before publishing.
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