Semiconductor and packaging power device metered filling: two-component epoxy case study

Background

An equipment integrator / manufacturer in Semiconductor and packaging needed to metered filling on a power device using two-component epoxy.

Process challenge

Supply pressure ripple during continuous running, causing volume drift.

Solution

We recommended Servo Dispensing Module + Screw Valve, with tuning rotor/stator fit and flow path geometry to the filler particle size.

Result

• Setup time cut from 40 minutes to under 15 minutes.
• Shot volume 0.008 mL with deviation within ±2%.
• Cycle time 0.7 s per dot with no stringing or dripping during continuous running.

Project facts

• Industry: Semiconductor and packaging
• Workpiece: power device
• Fluid: two-component epoxy
• Process: metered filling
• Recommended lines: Servo Dispensing Module, Screw Valve

Note: this case is placeholder demo content showing the structure of the section. Replace it with real project data before publishing.