Semiconductor and packaging BGA package substrate coating: filled thermal gel case study

Background

An equipment integrator / manufacturer in Semiconductor and packaging needed to coating on a BGA package substrate using filled thermal gel.

Process challenge

Very small shot volume with high repeatability demands, plus overflow and stringing risk.

Solution

We recommended Servo Dispensing Module + Screw Valve, with pairing a micro screw valve with a level sensor in closed loop for accurate volumetric output.

Result

Material utilisation improved by about 8% with visibly less waste.
Shot volume 0.4 mL with deviation within ±2%.
Cycle time 0.7 s per dot with no stringing or dripping during continuous running.

Project facts

Industry: Semiconductor and packaging
Workpiece: BGA package substrate
Fluid: filled thermal gel
Process: coating
Recommended lines: Servo Dispensing Module, Screw Valve

Note: this case is placeholder demo content showing the structure of the section. Replace it with real project data before publishing.