Semiconductor and packaging power device underfill: polyurethane potting compound case study

Background

An equipment integrator / manufacturer in Semiconductor and packaging needed to underfill on a power device using polyurethane potting compound.

Process challenge

Supply pressure ripple during continuous running, causing volume drift.

Solution

We recommended Servo Dispensing Module + Screw Valve, with using a high-flow pneumatic valve for staged potting together with vacuum de-airing.

Result

• Potting void defects reduced from 4% to below 1%.
• Shot volume 0.1 mL with deviation within ±2%.
• Cycle time 0.4 s per dot with no stringing or dripping during continuous running.

Project facts

• Industry: Semiconductor and packaging
• Workpiece: power device
• Fluid: polyurethane potting compound
• Process: underfill
• Recommended lines: Servo Dispensing Module, Screw Valve