Application Cases

201 articles

• 01.04 2026 Application Cases

  Medical and consumables microfluidic chip sealing and bonding: two-component epoxy case study

  sealing and bonding process on a microfluidic chip in Medical and consumables: bead width and height must stay…

• 01.03 2026 Application Cases

  Automotive electronics lamp module sealing and bonding: two-component epoxy case study

  sealing and bonding process on a lamp module in Automotive electronics: bead width and height must stay stable…

• 01.01 2026 Application Cases

  New energy and storage CCS busbar sealing and bonding: UV-curing structural adhesive case study

  sealing and bonding process on a CCS busbar in New energy and storage: tight cycle time with frequent changeov…

• 12.29 2025 Application Cases

  Semiconductor and packaging CSP chip sealing and bonding: UV-curing structural adhesive case study

  sealing and bonding process on a CSP chip in Semiconductor and packaging: tight cycle time with frequent chang…

• 12.26 2025 Application Cases

  Consumer electronics TWS earbud housing sealing and bonding: UV-curing structural adhesive case study

  sealing and bonding process on a TWS earbud housing in Consumer electronics: tight cycle time with frequent ch…

• 12.24 2025 Application Cases

  Optoelectronics and display display bezel underfill: UV-curing structural adhesive case study

  underfill process on a display bezel in Optoelectronics and display: particle fillers settling and clogging af…

• 12.24 2025 Application Cases

  Medical and consumables medical catheter underfill: UV-curing structural adhesive case study

  underfill process on a medical catheter in Medical and consumables: particle fillers settling and clogging aft…

• 12.22 2025 Application Cases

  Automotive electronics ECU unit underfill: UV-curing structural adhesive case study

  underfill process on a ECU unit in Automotive electronics: particle fillers settling and clogging after long i…