Application Cases

201 articles

• 07.30 2026 Application Cases

  Semiconductor and packaging power device metered filling: two-component epoxy case study

  metered filling process on a power device in Semiconductor and packaging: supply pressure ripple during contin…

• 07.28 2026 Application Cases

  Consumer electronics camera module metered filling: UV-curing structural adhesive case study

  metered filling process on a camera module in Consumer electronics: supply pressure ripple during continuous r…

• 07.25 2026 Application Cases

  Optoelectronics and display LED module sealing and bonding: UV-curing structural adhesive case study

  sealing and bonding process on a LED module in Optoelectronics and display: high fluid viscosity and resistanc…

• 07.23 2026 Application Cases

  Typical scenarios for servo dispensing modules

  When pneumatic extrusion cannot deliver the stability and speed control required, a servo solution is often th…

• 07.22 2026 Application Cases

  Medical and consumables IVD reagent cartridge sealing and bonding: UV-curing structural adhesive case study

  sealing and bonding process on a IVD reagent cartridge in Medical and consumables: high fluid viscosity and re…

• 07.20 2026 Application Cases

  New energy and storage prismatic battery cell sealing and bonding: UV-curing structural adhesive case study

  sealing and bonding process on a prismatic battery cell in New energy and storage: very small shot volume with…

• 07.20 2026 Application Cases

  Automotive electronics pressure sensor sealing and bonding: UV-curing structural adhesive case study

  sealing and bonding process on a pressure sensor in Automotive electronics: high fluid viscosity and resistanc…

• 07.18 2026 Application Cases

  Semiconductor and packaging BGA package substrate sealing and bonding: UV-curing structural adhesive case study

  sealing and bonding process on a BGA package substrate in Semiconductor and packaging: very small shot volume …