Semiconductor and packaging CSP chip coating: silicone sealant case study

Background

An equipment integrator / manufacturer in Semiconductor and packaging needed to coating on a CSP chip using silicone sealant.

Process challenge

Tight cycle time with frequent changeovers that squeeze setup time.

Solution

We recommended Servo Dispensing Module + Screw Valve, with using a high-flow pneumatic valve for staged potting together with vacuum de-airing.

Result

• Volume drift held within ±3% over an 8-hour run.
• Shot volume 0.1 mL with deviation within ±2%.
• Cycle time 0.7 s per dot with no stringing or dripping during continuous running.

Project facts

• Industry: Semiconductor and packaging
• Workpiece: CSP chip
• Fluid: silicone sealant
• Process: coating
• Recommended lines: Servo Dispensing Module, Screw Valve

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